Investigation of low dielectric constant (k) films for deep sub-micron CMOS application.

Silica (Si02) thin film on Si with low dielectric constant (k) properties has been systematically prepared and investigated. Two types of this low-k material have been deposited on Si via sol-gel spin-on coating. Filem nipis silika (Si02) yang berpemalar dieletrik rendah endap di atas Si tlah disediakan dan dikaji dengan sistematik. Dua jenis film nipis telah disediakan menggunkan pemutaran sol-gel